Engineered aluminum alloy liquid cold plates designed for superior heat transfer in high-power electronics like IGBT modules and industrial laser heads.
Constructed from lightweight, anti-rust 3003/6061/6063 aluminum alloy for enhanced durability and performance.
Features an extruded or CNC-machined M-shaped internal flow channel optimized for maximum coolant contact and heat dissipation.
Utilizes advanced vacuum brazing technology to ensure a seamless, leak-proof, and robust integrated module.
Offers exceptional thermal uniformity and a compact design, compatible with deionized water, glycol solutions, and dielectric fluids.
Highly versatile for applications including computer CPUs, GPUs, industrial inverter drivers, and semiconductor cooling.
Provides a cooling capacity of 200W, making it ideal for managing heat in high-density electronic components.
Material: Aluminum Alloy 3003, 6061, 6063
Dimensions (LxW): Customizable up to 1.2m x 1m
Cooling Capacity: 200W
Working Pressure: 1.2 to 5 Bars
Surface Flatness: < 0.1 mm
Recommended Coolants: Deionized Water, Inhibited Glycol/Water, Dielectric Fluid
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